Snow cleaning also has good application effects in surface cleaning of semiconductor ceramic packaging technology. Here are some advantages and effects of snow cleaning in surface cleaning of semiconductor ceramic packaging technology:

Efficient cleaning: Snow cleaning uses solid carbon dioxide (dry ice) ground or compressed into snowflakes. By projecting the snow cleaning agent onto the ceramic surface, it can quickly and thoroughly remove surface dirt and residues, improving the quality and reliability of ceramic packaging technology.

Safe and environmentally friendly: During the snow cleaning process, solid carbon dioxide immediately sublimates after cleaning, without generating wastewater, exhaust gases, or chemical emissions. It is non-toxic and harmless to the environment and operators, conforming to environmental standards.

Non-destructive cleaning: Snow cleaning uses mechanical impact and physical grinding to clean, without causing scratches, damage, or corrosion to the ceramic surface, maintaining the integrity and reliability of the product.

Removal of pollutants: Snow cleaning can effectively remove pollutants such as fluorides, nickel hydrous oxides, organic solvent residues, epoxy resin spills, material oxide layers, etc. It improves the purity and surface quality of ceramic packaging.

Improved adhesion: Snow cleaning can activate the ceramic surface while removing pollutants, increasing surface roughness and activity. It helps improve the adhesion and bonding tension between ceramics and other components such as leads and packaging materials.

In summary, snow cleaning has advantages and application effects such as efficient and safe cleaning, non-destructive cleaning, removal of pollutants, and improved adhesion in the surface cleaning of semiconductor ceramic packaging technology. It can improve the quality and reliability of semiconductor ceramic packaging.